JPH0254271U - - Google Patents
Info
- Publication number
- JPH0254271U JPH0254271U JP13336988U JP13336988U JPH0254271U JP H0254271 U JPH0254271 U JP H0254271U JP 13336988 U JP13336988 U JP 13336988U JP 13336988 U JP13336988 U JP 13336988U JP H0254271 U JPH0254271 U JP H0254271U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- board
- circuit board
- solder dip
- engaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Molten Solder (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13336988U JPH0254271U (en]) | 1988-10-14 | 1988-10-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13336988U JPH0254271U (en]) | 1988-10-14 | 1988-10-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0254271U true JPH0254271U (en]) | 1990-04-19 |
Family
ID=31391165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13336988U Pending JPH0254271U (en]) | 1988-10-14 | 1988-10-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0254271U (en]) |
-
1988
- 1988-10-14 JP JP13336988U patent/JPH0254271U/ja active Pending